Nate Lawson wrote: > Don't bother with the "soak and wick" method. The wick may suck away too > much solder from some pins and you'll end up with a weak connection. My > approach is to put a small amount of solder on the tip of the iron and > just touch it to the end of the pin/pad. If you've used enough flux on > the pins and pads, it will suck the solder off the tip and onto the pad, > leaving a nice fillet behind the pin. If you use wick, it will remove > that conection, leaving a very thin layer of solder on the pad and lower > edge of the pin. That's not enough to provide much structural strength. > I'll admit the flaws, but at the smallest pitches (TSSOP and such), even my 1/32" pinpoint tip won't wick solder onto just one pad with that technique. I do agree it works great at larger pitches, though. > For desoldering, use ChipQuik. Works very well and no chance of damaging > pins. But for practice boards, just use a heat gun to melt off all the > chips. > It's somewhat expensive, though. UNless you buy the kits for $16 + 10.00S&H, it's $32.00 + $10.00S&H. I doubt it'll matter to many on the list, but inexpensive rework stations are ~ $100.00. Message was sent through the cbm-hackers mailing listReceived on 2009-11-03 03:00:04
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