Re: Peel and stick heat-sinks

From: Gerrit Heitsch <gerrit_at_laosinh.s.bawue.de>
Date: Tue, 28 Feb 2012 18:14:52 +0100
Message-ID: <4F4D0B8C.7040108@laosinh.s.bawue.de>
On 02/27/2012 10:36 PM, Crock wrote:
> Hi Luke - Yes I have, they are OK, but not great. But then again
> something is better than nothing. :-)
>
> A much better option is two-part thermal adhesive. Both Zalman and
> Arctic Silver sell one.

I use a different method. The heatsinks I use are those:

  http://www.reichelt.de/bilder/web/artikel/C800/V5619A_F.jpg

They sell them in sizes for 40, 28 and 24 pin ICs. You can use thermal 
adhesive to mount them, but I don't like the idea of permanently 
covering up the MOS/CSG logo...

I use a small drop of thin heatsink compound in the middle of the IC and 
then use the heatsink to spread it out until the layer is as thin as I 
can make it. Then I use a drop of normal adhesive (not white glue or 
wood glue) at each end. Once dry it'll hold the heatsink in place during 
normal use but allows it to be removed without a trace if so desired. 
I've used this method for years and so far haven't had a heatsink fall off.

Also, if a socketed IC gets a heatsink, I put a small label on the 
underside that tells you what it is, including the datecode.

  Gerrit





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