On 10/30/11 19:00, Gerrit Heitsch wrote: > > From what I have read on the net so far, back then MOS had a much > faster turn around time to make a new revision which allowed the chip > designers to get a new revision much faster. Hi, Yes, they had their own fab, the process was much faster and easier then (0.8microns?, 3 metals?), and they probably had their own bonding machines to get the dies quickly into packages (ceramic for protos?). We poor Finnish design companies have to account for (multi-product wafer for prototyping) processing timetables (mask production, processing), fab schedules, package assembly and shipping times. :-) -Pasi Message was sent through the cbm-hackers mailing listReceived on 2011-10-30 20:00:21
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